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Semiconductor Packaging Manufacturing
This course will provide information on the various stages of semiconductor package manufacturing, including sort, assembly, and final test. In addition, we will also describe how to select, build, and test the packages with the die and other components to ensure the quality of the package and total assembly performance. We will also discuss the role of Process Control Systems in semiconductor manufacturing as they relate to quality testing. Specifically, we will explore how Process Control Systems can help identify and correct process problems that cause variation and quality issues. Finally, we also demonstrate how to use control charts to monitor the process performance. These can assist in decision-making, specifically when to take action to improve the process.
Duration
5 Months
Institution
Arizona State University
Format
Online
Eligibility Criteria
school
Academic Foundation
A recognized Bachelor’s degree or high school equivalent required for admission into Arizona State University.
language
Language Proficiency
English proficiency required. IELTS, TOEFL, or standard medium-of-instruction certificates accepted.
Detailed Fees Breakdown
Base Tuition Fee
$140
Total Est. Investment
$140
Scholarships and early-bird waivers may apply. Contact admissions for exact institutional fees.
Academic Trajectory
Program Outcome
Graduates of the Semiconductor Packaging Manufacturing program at Arizona State University are equipped with global perspectives, ready to excel in international markets and top-tier career opportunities.