verified
Verified Information • Last Updated Mar 2026
Advanced Semiconductor Packaging
Throughout this course, you will be introduced to Pathway for Assembly and Packaging technologies for 7-nanometer silicon feature sizes and beyond. The course will present the evolution and impact of packaging on product performance and innovation. Specifically, we highlight how packaging has enabled better products via the use of heterogeneous integration by improving the interconnects for thermal management and signal integrity.
Duration
3 Months
Institution
Arizona State University
Format
Online
Eligibility Criteria
school
Academic Foundation
A recognized Bachelor’s degree or high school equivalent required for admission into Arizona State University.
language
Language Proficiency
English proficiency required. IELTS, TOEFL, or standard medium-of-instruction certificates accepted.
Detailed Fees Breakdown
Base Tuition Fee
$192
Total Est. Investment
$192
Scholarships and early-bird waivers may apply. Contact admissions for exact institutional fees.
Academic Trajectory
Program Outcome
Graduates of the Advanced Semiconductor Packaging program at Arizona State University are equipped with global perspectives, ready to excel in international markets and top-tier career opportunities.